Copper & Tungsten-Copper Alloys: Thermal/Electrical Management
Cu/W composites combine copper’s conductivity (58 MS/m) with tungsten’s low thermal expansion (5.4×10⁻⁶/K), essential for semiconductor fixtures . The electronics segment will consume 12k tons by 2027.
screw, bolt, rivet and nuts are supported for customization inlcuding on material and on shape
Our Capabilities:
· High-Speed Cold Heading: WCu-80 heat sinks for IGBT modules.
· CNC Machining: EDM-cut fasteners for fusion reactor RF components.
Solution Highlight: Gradient sintering to optimize CTE/conductivity balance